Monday, May 15th – Opening Keynote Address
Efficient Use of Power Essential to Semiconductor Growth
presented by Hans Stork, Senior Vice President and Chief Technical Officer, ON Semiconductor
The five hottest areas for semiconductor growth in the coming years are the Internet of Things (IoT), automotive, 5G, virtual reality/augmented reality (VR/AR), and artificial intelligence (AI). These applications will challenge the semiconductor technology in multiple ways. Microprocessors and memories empower the analytical side, while sensors, displays, power management and analog functions drive the user interface. The benefit of advanced integration for increased performance and power density in processors and memories is well accepted. The need for energy efficiency touches also the interface functions, which are mostly small or large signal analog. Semiconductor devices that sense or deliver and transform sufficient energy are built using very different dimensions and process integration than their digital counterparts. Bringing these two together in small form factors may best be done using heterogeneous integration or packaging.
In this keynote, we will illustrate the challenge to realize high signal to noise ratio in small (read inexpensive) and efficient form factors, using examples of image sensors and power conversion in automotive applications. It seems that at last, after many decades of exponential progress in logic and memory technologies, the “real world” devices of power handling and sensor functions are jointly enabling another wave of electronics progress in autonomously operating and interacting Things.
Tuesday, May 16th – Keynote Address
A Quest for Human-Robot Cohabitation in the Age of Self Driving Automobiles
presented by Mohan M. Trivedi, Laboratory for Intelligent and Safe Automobiles (LISA), University of California San Diego
With recent advances in imaging sensors, embedded computing, machine perception, machine learning, high resolutions mapping, planning and control, intelligent vehicle technology is moving tantalizingly closer to a future with large-scale deployment of self-driving automobiles on roadways. However, we are also realizing that many important issues need deeper examination so that the safety, reliability and robustness of these highly complex systems can be assured for real world driving. Toward this end, we highlight research issues as they relate to the understanding of human agents interacting with the automated vehicle, who are either occupants of such vehicles, or who are in the near vicinity of the vehicles. The main idea is to develop an approach to properly design, implement and evaluate methods and computational frameworks for distributed systems where intelligent robots and humans cohabit, with proper understanding of mutual goals, plans, intentions, risks and safety parameters. We emphasize the need and the implications of utilizing a holistic approach, where driving in a naturalistic context is observed over long periods to learn behaviors of human agents in order to predict intentions and interactivity patterns of all intelligent agents. Development of highly automated vehicles opens new research avenues in machine learning, modeling, active control, perception of dynamic events, and novel architectures for distributed cognitive systems. This presentation will give examples of some of the accomplishments in the design of such systems and also highlight important research challenges yet to be overcome.
Wednesday, May 17th – Keynote Address
Next Generation MEMS Manufacturing
presented by Dr. Alissa Fitzgerald, Founder and Managing Member, A.M. Fitzgerald & Associates
Ten years ago, the iPhone sparked the fire of rapid growth in the MEMS market. Since then, MEMS motion sensors and microphones have become ubiquitous in smartphones, tablets, consumer electronics, and automobiles, with annual production volumes in the billions of sensors. To meet this demand, MEMS companies had to leverage the existing high volume foundries and manufacturing infrastructure, so MEMS sensor designs had to ‘play nice’ in the traditional CMOS process environment. The next generation of MEMS sensors already emerging for IoT and other large markets will not be as well-behaved. Exciting new sensors such as those for detecting gases, particles, infrared, LIDAR, micro-speakers and others will need CMOS-unfriendly materials such as piezoelectric thin films and glass. To meet the expected demands of consumer electronics or automotive OEMs, these sensors will need to be developed and produced in high volume 200mm wafer facilities. A generational change in manufacturing is coming, in which high volume foundries will need to break some of their traditional CMOS process rules or risk missing out on the next wave of growth in MEMS.
Wednesday, May 17th – Closing Keynote Address
IC Market Update and China Impact Analysis
presented by Bill McClean, President, IC Insights
A high level of uncertainty still looms over the global economy, sales of smartphones are beginning to saturate, and the Internet of Things looms on the horizon. In order to make sense out of the current turmoil, a top-down analysis of the IC market will be given and include trends in worldwide GDP growth, electronic system sales, and semiconductor industry capital spending and capacity. A critical look at China’s ambitions to become a bigger player in the IC industry will also be presented.
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