Tom Bondur is corporate vice president of Advanced Packaging and MEMS/IoT Businesses at Lam Research. Mr. Bondur is responsible for representing Lam Research as the business executive in high level customer interactions, defining specific market requirements for Lam to be a leader in these markets, and developing business strategies that accelerate Lam’s growth in the Advanced Packaging and “more than Moore” equipment market opportunities. He brings over 20 years of high-tech and semiconductor experience to this role. Mr. Bondur returned to Lam Research following three years at Cymer, an ASML company, where he was leading Global Sales and Field Operations. From 2001 to 2011, Mr. Bondur held various positions at Lam Research including vice president of Business Development, vice president of Global Sales, and vice president of Global Field Operations. Previously, he was at Applied Materials in Santa Clara, CA and Meylan, France where he was in Sales, Business Management, and Process Engineering roles.
Bill has an extensive background in academia, venture funding, and in the commercial semiconductor equipment sector. Since founding Third Millennium Test Solutions Inc. (3MTS) in 1999, he has provided strategic leadership and vision in keeping with the promise of the 3MTS business model. Bill has also served on a number of important government and industry committees and advisory positions. Key posts include chairmanship of the subcommittee of the Technical Advisory Committee of the United States Commerce Department’s Export Control Commission for Semiconductor Equipment and Materials. He was the initial president of the Semiconductor Equipment Group of Varian Associates and Chairman and CEO of Credence. Prior to joining Credence, Bill spent more than ten years in the venture capital industry as a partner of APA. Shortly after receiving his doctorate in physics, Bill joined the electrical engineering faculty of Princeton University, where he remained until 1976. He then joined Varian Associates in Palo Alto, California, as manager of research and development, and he was later named president of Varian’s newly formed semiconductor equipment group.
David Butler currently serves as the Vice President of Product Management and Marketing at SPTS Technologies, and has more than two decades of experience in the semiconductor capital equipment and related industries. He first joined Electrotech in 1988 as a Senior Process Engineer, then moved to Product Marketing for Electrotech’s PVD products. In 2004, he assumed the role of Director of Marketing for the PVD/Etch/CVD products at Trikon, becoming Vice President of Marketing for the three product lines at Aviza Technology following the merger of Aviza and Trikon. In 2009, following the formation of SPTS Technologies, Mr. Butler was appointed VP of product and corporate marketing, overseeing all marketing efforts for SPTS’s full range of PVD, Etch, CVD and thermal products.
David leads Worldwide Semiconductor Business Development & Solution for Siemens PLM Software. In this role, he defines solution strategy and definition, and customer development. Before moving to his current position, David worked at several semiconductor companies – TSMC, Synopsys, LSI Logic and Lattice Semiconductor – as senior manager position. As a senior manager at TSMC, he was responsible for design, development, and operation of the company’s Open Innovation Platform (OIP), Design & Manufacturing Platform and TSMC Online.
Bill currently holds the position of Senior Technical Advisor at ASE (U.S.) Inc. Prior to joining the ASE Group, Bill was Director of the Institute of Materials Research & Engineering (IMRE), located in the National University of Singapore. Previously, Bill worked for over thirty three years performing various R&D and management positions at IBM Corporation, where he was elected to the IBM Academy of Technology. He is currently the co-chair of the International Technology Roadmap for Semiconductors (ITRS) Assembly and Packaging International Technical Working Group. Bill has been an associate editor of the IEEE/CPMT transactions, and the ASME Journal of Electronic Packaging, and has published extensively in the fields of microelectronics packaging and mechanics of materials. He held the position of President of the IEEE Components, Packaging and Manufacturing Technology Society (CPMT) from 2006-2009. Bill has been elected a Fellow of IEEE and a Fellow of ASME. Bill has held adjunct faculty appointments at Cornell University, Binghamton University, University of Washington, and a visiting faculty appointment at Hong Kong University of Science of Technology. He received his B.Sc. at University of London, M.Sc at Brown University and PhD at Cornell University.
Jean-Christophe Eloy, President and CEO, Yole Développement
JC Eloy created YOLE Développement in 1998 and is the President and CEO in charge of the international development and strategic orientations of the company. He is directly involved in the MEMS fields as advisor of YOLE customers and for M&A activities. JC and the 30 analysts of YOLE Développement work directly with key players of the industry from equipment and materials suppliers to device manufacturers and system integrators in MEMS, power electronics, LED, photovoltaic and compound semiconductor business. He has been 6 years managing the marketing department of CEA/LETI (France), applied R&D organization involved in the semiconductor, MEMS and instrumentation fields (1500 researchers). He then created the semiconductor practice at Ernst & Young in Europe and worked as senior manager in charge of the development of European activities. JC is also a board member of several companies in Europe and North America.
Alissa Fitzgerald, Founder and Managing Member, A.M. Fitzgerald & Associates
Dr. Fitzgerald founded A.M. Fitzgerald & Associates, LLC (“AMFitzgerald”), a MEMS and sensors solutions company, in 2003. She has over 20 years of engineering experience in MEMS design, fabrication, and product development, and has personally developed more than a dozen MEMS devices. She now advises clients on the entire technology development cycle, from business and IP strategy, to initial design and prototyping, to foundry transfer and supply chain management. Prior to founding AMFitzgerald, Dr. Fitzgerald worked at the Jet Propulsion Laboratory, Orbital Sciences Corporation, Sigpro, and Sensant Corporation, now part of Siemens. She received her bachelor’s and master’s degrees from MIT and her doctorate from Stanford University, in Aeronautics and Astronautics. Dr. Fitzgerald has numerous journal publications and holds seven patents. She served on the Governing Council of the MEMS Industry Group (MIG) from 2008-2014 and was inducted into the MIG Hall of Fame in 2013.
Subramani Kengeri, Vice President, GLOBALFOUNDRIES
Subramani (Subi), Vice President of CMOS Platforms BU, is responsible for business results across Advanced technology nodes at Fab1 (Germany) in support of world-wide customers and company’s financial objectives. Most recently, he was the Vice President of Global Design Solutions responsible for world-wide design engineering, semiconductor design eco-system development and design-technology co-optimization. His team enabled IP, EDA and SoC solutions in support of “first time right” technology qualification and customer SoC differentiation. He was also responsible for determining technology feasibility, competitiveness and manufacturability of technology platform through design-technology Interactions with customers, technology R&D and design eco-system. Subi joined GLOBALFOUNDRIES in 2009 as the Vice President of Design Solutions. He implemented strategic design enablement initiatives and established a strong foundation for collaboration with semiconductor design eco-system. For 3 years, as the Head of Advanced Technology Architecture, in the Office of the CTO, Subramani was responsible for defining competitive 14nm, 10nm and 7nm technology platforms
Valerie Marty, Founder, Connected Micro
Valerie is the founder of Connected Micro providing engineering services for small companies navigating commercialization challenges. Valerie contributed to the advancement of CMOS and MEMS technologies at Hewlett Packard as an R&D engineer and later became the Global Technical Communities Lead. In 2014, Valerie became a Hall of Fame Inductee within the MEMS & Sensors Industry Group and is a proud alumni of the Technical Advisory Committee. Valerie holds an MS in Physical Chemistry from Oregon State University.
Jason Marsh, Director of Technology/CTO, NextFlex
Jason Marsh is responsible for setting the technical direction of NextFlex, including managing Technical Council activities. Prior to joining NextFlex, Jason worked in Japan, India, Germany, Mexico, Malaysia and China, where he lived between 2003 and 2008, establishing greenfield factories for Kyocera. As Vice President at Insulectro, Jason focused on new materials and supply-chain strategies for the printed circuit board and flexible hybrid electronics industries, focusing on high reliability applications. Jason studied materials science and robotics at Stanford University, and worked on early versions of 3D printing using ceramics and metals, as well as developed instruments for physics experiments such as Gravity Probe B. He has served on advisory boards and consulted for companies in artificial intelligence, outdoor equipment, solar power, and agriculture.
Bill McClean, President, IC Insights
Mr. McClean began his market research career in the integrated circuit industry in 1980 and founded IC Insights in 1997. During his 37 years of tracking the IC industry, Mr. McClean has specialized in market and technology trend forecasting and was responsible for developing the IC industry cycle model. At IC Insights, he serves as managing editor of the company’s market research studies and reports. In addition, he instructs for IC Insights’ seminars and has been a guest speaker at many important annual conferences held worldwide (e.g., SEMI’s ISS and Electronic Materials Conferences, The China Electronics Conference, and The European Microelectronics Summit). Mr. McClean received his Bachelor of Science degree in Marketing and an Associate degree in Aviation from the University of Illinois.
Vinayak Pandey, Vice President – STATSChipPac
Vinayak Pandey is the Vice President of Product Technology Marketing at STATS ChipPAC where he is responsible for managing product marketing and business development for the US and Europe regions. He has been with STATS ChipPAC since 2008 and has held several positions in product line management, business development and product marketing. Prior to STATS ChipPAC, Vinayak worked at Intel Corporation in CPU packaging for desktop, server and mobile platforms. He has a Master of Business Administration from Arizona State University and a Master of Science degree in Engineering Mechanics from Virginia Tech.
Mike Rosa, Head of Marketing, 200mm Equipment Products Group, Applied Materials
Dr. Mike Rosa serves as Sr. Strategic & Technical Marketing Manager – Emerging Technologies, Components & Systems Group (CSG), AGS at Applied Materials, Inc. He has over 15 years of technology focused product and business development experience, and over 16 years of technology focused product and business development experience. Prior to joining Applied Materials, Mike held various contributor level and senior leadership positions within the United States and Australia, working for technology focused companies that included Xerox Corporation, Australian Microelectronics Centre (AMC) and National ICT Australia (NICTA). Mike has authored over 35 journal and conference publications and hold over 25 U.S. patents concerning various applications of MEMS and Microsystems technology.
Laura Rothman Mauer, Chief Technical Officer, Veeco
Laura Rothman Mauer is currently the Chief Technical Officer at Veeco Precision Surface Processing (PSP), formerly Solid State Equipment LLC. Laura led the company into the burgeoning field of 3D packaging with new applications and processes. For over 35 years Laura has worked in the semiconductor industry in technical areas including semiconductor and packaging process development, reliability engineering, contamination control, environmental technologies, and knowledge management. Her time as Program Manager for IBM, Chief Technology Officer at SC Fluids, and Director of R&D for Brewer Science gave her the well-rounded know-how and perspective that enables her to confidently lead Veeco PSP into new and growing fields of the semiconductor industry.
Islam Salama, Director, Intel
Dr. Islam Salama is a Director with Intel Corporation responsible for packaging substrate Pathfinding of the high density interconnect across all Intel products. In this capacity, he manages a global team of technologists and manufacturing team responsible for delivering next generation packaging technologies. His team is focusing on packaging architectures, technology building blocks, intellectual property management, and supply chain echo system development. Islam has a Ph.D. in laser materials processing from the College of Optics and Photonics (CREOL), UCF and has been with Intel since 2003. Islam authored over 30 technical papers, was awarded more than 50 international patents in the fields of HDI substrate technology, laser technology, materials processing and semiconductor fabrication. Islam is an elected member of the board of directors for the Laser Institute of America (LIA), a senior member of the steering committee with the international technology manufacturing initiative (iNEMI), and a board member of Applicote Associates LLC-a photonics and manufacturing technology start-up.
Kevin Shaw, CTO and Co-founder, Algorithmic Intuition
Kevin is a lifelong entrepreneur with a deep love of technology. He has strong experience in startups, semiconductors, business development, product development and team building. He has a PhD in EE/MEMS from Cornell University, a Masters in Management from Stanford University’s Graduate School of Business and 30 U.S. Patents in MEMS and algorithms. He is also Adjunct Faculty at Singularity University for MEMS, Sensors and IoT. Kevin was CTO of Sensor Platforms Inc. from 2009 until its acquisition by Audience in 2014. Before that he established the Sensor Algorithms team and ran Business Development. Previously, he co-founded his first company (sold in 2004) and worked at Kionix Inc, a MEMS semiconductor foundry as its 3rd employee (acquired in 2000).
Hans Stork, Senior Vice President and Chief Technology Officer
Dr. Hans Stork joined ON Semiconductor in 2011 as Senior VP and CTO responsible for the company’s product research and development. With nearly three decades of experience in technology and product development, he has held various leadership positions including Group Vice President and CTO of the Si Systems Group at Applied Materials, and Senior Vice President and CTO of Texas Instruments and director of Si Technology Development at TI. During his career, Dr. Stork has worked with some of the semiconductor industry’s leading innovators including Hewlett Packard and IBM Research. He holds a PhD in Electrical Engineering from Stanford University, and an Electrical Engineering Ingenieur (Cum Laude) from Delft University in the Netherlands. He has authored numerous scientific articles and papers, and served as a board director for Sematech and the Semiconductor Research Corporation (SRC) and is a member of the Scientific Advisory Board for IMEC.
Mohan Trivedi, Distinguished Professor of Electrical and Computer Engineering, founding director of the Computer Vision and Robotics Research Laboratory and the Laboratory for Intelligent and Safe Automobiles at UCSD
Mohan Trivedi is a Distinguished Professor of Electrical and Computer Engineering and founding director of the Computer Vision and Robotics Research Laboratory, as well as the Laboratory for Intelligent and Safe Automobiles (LISA) at the University of California San Diego. Currently, Trivedi and his team are pursuing research in intelligent vehicles, autonomous/self-driving, machine perception, machine learning, human-robot interactivity, advanced driver assistance, active safety and intelligent transportation systems. Trivedi’s team has played a key role in several major research collaborative initiatives. These include human-centered vehicle collision avoidance, lane-change/turn/merge assistance systems; vision-based systems for “smart” airbags, predictive driver intent and activity analysis systems; and panoramic-view surround safety systems. He has published over 500 archival papers, has won over 20 “Best/Finalist” Paper award, has received the IEEE ITS Society’s Outstanding Research Award and LEAD Institution Award as well as the Meritorious Service and Pioneer Award (Technical Activities) of the IEEE Computer Society. He has given over
100 keynote/plenary talks and he regularly serves on panels dealing with technological, strategic, privacy, and ethical issues surrounding research areas he is involved in. He is a Fellow of IEEE, SPIE, and IAPR. Trivedi has served as the Robotics TC Chair for the IEEE Computer Society, on the Governing Boards of the IEEE SMC and ITSC Society, EIC of the Machine Vision Applications journal and charter member of the University of California System wide Digital Media Innovation (UC Discovery) program. He has received Distinguished Alumnus awards from BITS, Pilani, India and Utah State University. Trivedi serves regularly as a consultant to industry and government agencies in the USA and abroad.
E. Jan Vardaman, President, TechSearch International
Jan is the editor of Surface Mount Technology: Recent Japanese Developments, co-author of How to Make IC Packages (published in Japanese by Nikkan Kogyo Shinbun), a columnist with Circuits Assembly Magazine, and the author of numerous publications on emerging trends in semiconductor packaging and assembly. She served on the NSF-sponsored World Technology Evaluation Center study team involved in investigating electronics manufacturing in Asia and on the US mission to study manufacturing in China. She is a member of IEEE CPMT, IMAPS, SMTA, and SEMI. She was elected to two terms on the IEEE CPMT Board of Governors. She received her BA in Economics and Business from Mercer University in Macon, Georgia in 1979 and her MA in Economics from the University of Texas at Austin in 1981. Before founding TechSearch International, she served on the corporate staff of Microelectronics and Computer Technology Corporation (MCC), the electronics industry’s first pre-competitive research consortium.
Pete Singer, Editor in Chief, Solid State Technology, The ConFab Conference Chair
Pete Singer oversees the editorial operations of Solid State Technology and is the conference chair of our annual event, The ConFab. He has been covering the semiconductor industry for more than 30 years and has written over 160 articles on all aspects of semiconductor manufacturing, design, test and packaging.
Pete holds a degree in Electrical Engineering from the University of Illinois, Champaign-Urbana.
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