A new wave of growth is sweeping through the semiconductor industry, propelled by a vast array of new applications, including artificial intelligence, virtual and augmented reality, automotive, 5G, the IoT, cloud computing, healthcare and many others. The big question facing today’s semiconductor manufacturers and their suppliers is how they can best position themselves to take advantage of this tremendous growth.
Sunday, May 20
|4:00 pm – 5:00 pm||Registration – Badge and conference materials|
|5:30 pm – 7:00 pm||Welcome Cocktail Reception|
Monday, May 21
|7:00 am – 5:00 pm||Registration|
|7:00 am – 7:55 am||Networking Breakfast – Complimentary|
|7:55 am – 8:00 am||Welcome – Pete Singer, Conference Chair and Editor-in-Chief of Solid State Technology|
8:00 am – 8:40 am KEYNOTE: How AI is Driving the New Semiconductor Era
presented by Rama Divakaruni, Advanced Process Technology Research Lead, IBM
The exciting results of AI have been fueled by the exponential growth in data, the widespread availability of increased compute power, and advances in algorithms. Continued progress in AI – now in its infancy – will require major innovation across the computing stack, dramatically affecting logic, memory, storage, and communication. Already the influence of AI is apparent at the system-level by trends such as heterogeneous processing with GPUs and accelerators, and memories with very high bandwidth connectivity to the processor. The next stages will involve elements which exploit characteristics that benefit AI workloads such as reduced precision and in-memory computation. Further in time, analog devices that can combine memory and computation, and thus minimize the latency and energy expenditure of data movement, offer the promise of orders of magnitude power-performance improvements for AI workloads. Thus, the future of AI will depend instrumentally on advances in devices and packaging, which in turn will rely fundamentally on materials innovations.
8:40 am – 9:20 am KEYNOTE: Quantum Supremacy: Checking a Quantum Computer with a Classical Supercomputer presented by John Martinis, Head of Quantum AI Lab, Google
As microelectronics technology nears the end of exponential growth over time, known as Moore’s law, there is a renewed interest in new computing paradigms such as quantum computing. A key step in the roadmap to build a scientifically or commercially useful quantum computer will be to demonstrate its exponentially growing computing power. I will explain how a 7 by 7 array of superconducting xmon qubits with nearest-neighbor coupling, and with programmable single- and two-qubit gate with errors of about 0.2%, can execute a modest depth quantum computation that fully entangles the 49 qubits. Sampling of the resulting output can be checked against a classical simulation to demonstrate proper operation of the quantum computer and compare its system error rate with predictions. With a computation space of 249 = 5 x 1014 states, the quantum computation can only be checked using the biggest supercomputers. I will show experimental data towards this demonstration from a 9 qubit adjustable-coupler “gmon” device, which implements the basic sampling algorithm of quantum supremacy for a computational (Hilbert) space of about 500. We have begun testing of the quantum supremacy chip.
9:20 am – 10:45 am Session 1: Industry Trends and Challenges
The Era of Deep Learning IC Industry Driven by AI, Autonomous Driving and Virtual Reality presented by John Hu, Director of Advanced Technology, Nvidia Corporation
The big bang of AI and autonomous driving has driven the IC industry into a new era of rapid growth and innovation. Virtual reality has also become the new real world, enabled by advancements in computing and the progress in AI and big data. These have enabled innovative applications beyond just simply replacing human labor, automation and augmenting intelligence. It will also impact and innovate all aspects of our lives and the industry. On the other hand, traditional scaling by Moore’s Law has slowed down. New innovations are required to meet the continued demand of computing perf and power efficiency, and more functionalities.
New innovations have come from algorithms, system platform and chip architectures, such as GPUs and SOCs with embedded deep learning accelerators optimized for AI, and new technologies for heterogeneous computing such as 2.5D/3D and new logic/memory integrations. These have resulted in 100~1000 times improvement in past few years. The exponential improvement in computing capabilities and new functionalities, has also further fueled the exponential growth of big data generated by AI, VR and autonomous driving. The next 1000 times of improvement requires a new paradigm shift in the collaboration and co-optimizations across the whole industry; from materials, process technologies, design and chip/system platform. In this era that machine can improve themselves by deep learning, the semiconductor industry also need to have the capability of deep learning for innovation, to stay ahead in the changing competitive landscape.
Driving Autonomous – Turning the corner with Location X-ray Vision presented by Rajeev Rajan, Vice President – IoT Solutions and Engineering, HERE Technologies
With the Internet of Things (IoT) and Self-Driving cars upon us, the challenges and opportunities we now face are how to manage tens of billions of devices and vehicles. Whether it’s solving real-world problems in Data Collection, Asset Management, Transportation and Logistics or Autonomous cars, these segments are inter-woven thru the key capabilities of mapping, positioning, tracking, and location analytics.
This presentation will introduce HERE Technologies and take you through the progression of IoT and Autonomous Driving thru the lens of location intelligence. HERE is tackling one of the most complex technical challenges associated with driverless cars: helping them see around the corner. The Autonomous Driving team at HERE is building the highly precise, machine readable map that self-driving cars need to position themselves on the road, anticipate what’s coming ahead, and ensure passenger comfort. Perfecting the map will be essential in an autonomous future.
Enabling a Startup Ecosystem for Semiconductors presented by Dan Armbrust, Founder and Director, Silicon Catalyst
To realize optimistic expectations for growth associated with the next wave of solutions built upon semiconductors, innovation and entrepreneurship generally associated with startups will be even more crucial. However, indicators ranging from IPO’s, venture capital investment, and organic industry growth rates strongly suggest that new business models are needed. In this context, see how a new early-stage startup incubator called Silicon Catalyst, launched in Silicon Valley, has been operational for three years. Learn why its unique focus is on semiconductor solutions in creating a supporting ecosystem to address the prototyping needs of today’s chip design and MEMS entrepreneurs. Understand why there is a recent resurgence in startups pursuing hardware innovation to support the needs of advanced applications leveraging artificial intelligence and machine learning and advanced sensing technologies.
|10:45 am – 11:05 am||Break – Refreshments|
|11:15 am – 12:00 pm||Private Business Meetings|
|12:00 pm – 1:00 pm||Networking Lunch – Complimentary|
|1:10 pm – 1:55 pm||Private Business Meetings|
2:05 pm – 3:15 pm Session 2: Real World Applications
AI Hype at the Teardown Level presented by Andy Wei, Senior Fellow / Technology Analyst, TechInsights
The recent confluence of cloud, big data, and a rapid increase in compute power has led to the explosion in AI applications in our everyday lives. With applications based on basic visual and audio pattern recognition commercialized, we are poised to see bigger strides to come in the near future. Or are we? We will review the hardware behind AI applications we interact with today, from GPUs, FPGAs, dedicated accelerators and IP cores, system-level memory improvements, and “AI-enabled” products on the market today. Understanding the present state of the market and technology will allow us to answer, will AI live up to the hype?
A Digital Strategy for Your Enterprise presented by Fram Akiki, Vice President, Electronics Industry Strategy for Siemens PLM
Digitalization changing our daily lives as well as existing business models from product-centric development and manufacturing to creating opportunities for extended value throughout the lifecycle. Successful companies are seizing the opportunities offered by digitalization to increase their competitiveness in the digital world. Trends like the boom in automotive electronics and (IoT) smart connected products all provide gains and growth to the industry but at the same time pose real challenges. Difficulty in predicting the market growth or decline and the need to adjust quickly to these challenges increases the pressure on product development and manufacturing infrastructure and processes. Further complicating matters is the supply chain challenges and the varying demands of the customer. Connecting the digital thread between designs and manufacturing helps to close the gaps and not only makes sense but can open up a vast array of new business opportunities. Initiatives like Smart Manufacturing, and new emerging capabilities like machine learning and predictive analytics can also help to provide the necessary insight and agility needed to meet the needs of the customer and the demands of the industry. However they come at a cost, can cause disruption and can fall to the wayside if not well implemented. This makes choosing the right partner and the adoption of a well thought out digitalization strategy mission critical.
Wireless Power in Medical Implants presented by Bill von Novak, Wireless Power Group Lead, Qualcomm
Medical implants require power to operate – from microwatts to watts, in some cases. This power once came from primary batteries, but as power draws have increased and technology has improved, this power comes more often from secondary batteries and wireless charging. Wireless charging adds another challenge for implant designers – varying voltages, thermal concerns due to inefficiencies, and requirements for startup at zero state of charge – which can all add complexity to an implant power design. This presentation reviews wireless power implementations in medical implants and provides design examples.
|3:15 pm – 3:30 pm||Break – Refreshments|
|3:40 pm – 4:25 pm||Private Business Meetings
4:30 pm – 5:15 pm Session 3: Panel Discussion – Trends and Opportunities in A.I
Tom Ho, President, BISTel America
Han-Joo Lee, VP of System Engineering, SK Hynix
Howard Witham, Vice President of Texas Operations, Qorvo
Rama Divakaruni, Advanced Process Technology Research Lead, IBM
Artificial Intelligence, Big Data and advanced trace analytics can help semiconductor manufacturers reduce root-cause analysis time and improve production efficiency. More data than ever is becoming available as a result of increasing sophistication in manufacturing devices and the growing trend in network convergence between IT and OT. With the adoption of technologies around Industrial Internet of Things (IIoT) and Big Data, manufacturers are well positioned to turning the plethora of data into relevant information – Manufacturing Intelligence (MI). In this session, panelists will discuss how the semiconductor industry can improve with increased integration and better analytics, how to overcome concerns about data security, and boost collaboration across the supply chain.
|6:00 pm – 7:00 pm||Networking Cocktail Reception|
Tuesday, May 22
|7:00 am – 5:00 pm||Registration
|7:00 am – 7:55 am||Networking Breakfast – Complimentary|
8:00 am – 8:45 am Keynote: Packaging and Heterogeneous Integration presented by David McCann, VP Packaging and Test, Development & Operations, GLOBALFOUNDRIES
Advances in Moore’s law are slowing due to cost of design and fabrication in advanced nodes. In addition, packaging has not scaled with Moore’s Law. Package scaling now must happen to bring higher performance solutions to market required for AI, ML, and GPU applications. Most solutions require heterogeneous integration of chips from different nodes and processes. Integration of processors with memory in 2.5D has been the first driver for heterogeneous integration but have not been without challenges. 3D and SiPh technologies are next. 3D SRAM stacks on logic will enable an order of magnitude leap in interconnect density and power reduction per interconnect. Further package scaling enabling heterogeneous integration will be needed for system level solutions. Application needs, challenges, and solutions will be discussed.
8:45 am – 10:15 am Session 4: Advances in Semiconductor Manufacturing
Thirty Years in the Making: EUV in High-Volume Manufacturing presented by Erik Hosler, Lead EUV Technologist, GLOBALFOUNDRIES
Over 30 years after the initial EUV lithography demonstration, the semiconductor industry is poised to launch EUV lithography into high-volume manufacturing at the 7nm technology node. Recent developments in source power, resist performance and mask manufacturability have enabled this landmark transition, while extensive process and device enablement have been concurrently demonstrated, highlighting the in-fab advantages of EUV lithography. However, hurdles still remain for insertion and productivity suitable for high-volume manufacturing, and the industry must now start looking at the technology’s longevity beyond insertion and the challenges that remain to achieve the ultimate printed feature resolution with high-NA EUV lithography.
The Potential of A.I. in the Semiconductor Fab presented by Howard Witham, Vice President of Texas Operations, Qorvo
Artificial intelligence has brought human beings to a point in history, for our industry and the world in general, that is more revolutionary than a small, evolutionary step. The application of neural networks to semiconductor manufacturing is beginning to automate the role of the engineer. A.I. provides predictive maintenance, auto defect and wafer map classification, outlier detection, automated recipe setups based on device requirements and upstream data, and dynamic interpolation and guard-banding. For factory yield control, algorithms determine process inputs and outputs to optimize fab yield, and a Digital Twin of the entire factory enables advanced analytics to predict and improve fab yield. It also enables device, lot, and product specific input optimization.
Foundry 2.0 – the Rise of the Technology Foundry presented by Thomas Sonderman, President, SkyWater Technology Foundry
As we begin 2018, the semiconductor foundry landscape is becoming more diverse than ever before in its ability to enable product and technology innovation. Thanks to growing macro-economic trends around smart homes and cities, connected cars, clean energy and cloud computing, a new sub-set of product and technology needs are emerging that are not driven by a thirst for next-node leadership. These emerging product categories require a different foundry model, a technology foundry model that marries custom product development and volume manufacturing acumen, to take these unique designs from concept to reality. SkyWater Technology Foundry is at the heart of this manufacturing renaissance, enabling customers to innovate through bringing together IDM development know-how with scalable foundry manufacturing. In this presentation, Tom will talk about the rise of the technology foundry, and the unique growth opportunity for this emerging segment in the semiconductor manufacturing eco-system.
Thin-film Processing Based Manufacturing Technology for Phase Change Memory (PcRAM) presented by Dr. Koukou Suu, General Manager, ULVAC
Smart ICT (Information and Communication Technology) such as “Big Data”, “Cloud computing” and Smart Functionalities such as Stand-alone Self-activating MEMS/Sensors construct Smart Systems which enable IoT (Internet of Things), IoE (Internet of Everything) thus Smart Society. To realize above-mentioned Smart Technologies, high-density, low-power consumption, wide-bandwidth, fast-operation semiconductor devices as well as smart functional devices enabled by integrating functionalities with advanced semiconductor technologies including CMOS technologies are necessary. Thin-film functional material such as phase-change (Ge2Sb2Te5) and selector materials have been utilizing to form advanced semiconductor devices including Phase-Change Random Access Memory (PcRAM) for Smart ICT solutions. In this talk, we will give presentation our development activities of phase-change material thin- film processing technologies including sputtering, MOCVD and plasma etching as well as manufacturing processes for Phase-Change Random Access Memory (PcRAM).
|10:15 am – 10:30 am||Break – Refreshments|
|10:40 am – 11:25 am||Private Business Meetings|
|11:30 am – 12:15 pm||Private Business Meetings|
|12:15 pm – 1:25 pm||Networking Lunch – Complimentary|
|1:30 am – 2:15 pm||Private Business Meetings|
2:25 pm – 4:00 pm Session 5: Panel Discussion – Heterogenous Integration
Moderated by Dr. William Chen, Fellow, ASE
Rozalia Beica, Global Director, DowDuPont
Bill Bottoms, Chairman, 3MTS
David McCann, VP Packaging and Test, Dev. & Operations, GLOBALFOUNDRIES
Dr. Meyya Meyyappan, Chief Scientist, NASA Ames Research Center
Xin Wu, Vice President – Silicon Technology, Xilinx
System level package innovation and heterogeneous integration encompass a wide range of technologies, including module and 3D packaging, system-in-package (SiP), fanout, and embedded technologies. But questions remain. How will these technologies be utilized in advanced data centers & network systems, in future smart phones, and the growing medical, industrial and lifestyle IoT applications? This session, sponsored and organized by IEEE’s CPMT Society, will look at how packaging technologies are enabling innovative solutions that achieve system application requirements while maximizing system level performance, and, meeting cost, performance, form factor and reliability goals.
4:30 pm – 5:15 pm Session 6: Panel Discussion – Trends and Opportunities in Automotive Electronics
Rob Cappel, Senior Director of Marketing, KLA-Tencor
Jim Roberts, Supplier Quality Manager Electronics NA, Continental Automotive Systems
Dr. Lauren Link, Packaging Engineer
Jay Rathert, Senior Director Strategic Collaborations, KLA-Tencor
A trend that will continue in 2018 is the rise of the smart, autonomous car. As consumers and regulators demand more capability from automobiles, semiconductors have become the most critical part of these innovative solutions. But these chips, designed to bring safety and economy to the car’s operation, also bring complexity and higher requirements for reliability, requirements that have not been seen in other consumer segments like mobile devices and personal computing. Many of the semiconductors that are now part of Advanced Driver Assistance Systems (ADAS) are critical to the function and safety of the vehicle, where failures cannot be tolerated. This session will focus on the future of autonomous driving, the challenges facing the semiconductor industry and what we may see in the coming years. Panelists from the car manufacturing industry and the semiconductor industry will share insight on what they believe the biggest challenges will be and how we, as an industry, will face these challenges.
|6:00 pm – 7:00 pm||Networking Cocktail Reception|
Wednesday, May 23
|8:00 am – 9:00 am||Networking Breakfast – Complimentary|
|8:15 am – 9:00 am||Private Business Meetings|
9:10 am – 9:55 am Keynote: Nanomaterials and Nanotechnologies in the Semiconductor Industry presented by Meyya Meyyappan, Chief Scientist for Exploration Technology at NASA Ames Research Center
Nanotechnology is widely believed to be the technology of the 21st century with expected impact in every economic sector. We have witnessed over the last two decades the emerging of carbon nanotubes, graphene and other 2D materials, often accompanied by a great deal of hype. Basic research related to their growth, characterization and application development has made significant progress. The outstanding electrical properties of the carbon nanomaterials have led to the possibility of using them for interconnects replacing copper and their excellent thermal properties could be useful for heat dissipation in chip cooling. Beyond that, active electronics and circuits using the nanomaterials as the active channel replacing silicon have received extensive attention. Emerging areas such as flexible/printed electronics and sensor systems on a chip appear to benefit much from the interesting properties of nanomaterials. This talk will provide an overview of the state of the art in the above applications along with the challenges and future outlook.
9:55 am – 10:25 am Session 7: Analyst Perspectives
Global Semiconductor Market Trends: Innovative Technologies Provide the Platforms of Industry Growth presented by Len Jelinek, Senior Director – Chief Analyst, IHS Markit
Innovative technology platforms within manufacturing are at the heart of end market system development. The emergence of 7 nanometer leading-edge technology is forecast to be a key technology at the heart of new products targeted at AI, Autonomous driving and 5 G mobile infrastructure. The presentation will look back at the first half of 2018 and forecast overall market trends in the 6 major semiconductor market segments through 2021 by looking at key equipment within each market segment. It will also cover what technologies and products have driven the semiconductor industry during the first half of 2018 and what is the forecast for the next generation of products that will drive industry revenue growth out through 2021, as well as what capital injections are being made in support of long-term revenue growth for the semiconductor industry.
|10:30 am – 10:45 am||Break – Refreshments|
|10:50 am – 11:20 am||Sessions Resume|
Emerging Technology Markets Fueling IC Growth presented by Jim Feldhan, President, Semico Research
While smartphones growth has declined, total IC demand for smartphones still comprises the largest end market segment for the semiconductor industry. Innovation continues in this market bringing new high performance silicon and package technology opening the door to the next generation of system capabilities. These performance systems enable new features such as AI, VR, and AR among others. But the spotlight is focused on the automotive industry where leading edge technology is being rapidly developed to enhance safety systems, create virtual cockpits, and enable connected vehicles. ADAS will become the next supercomputing application. How will the evolution of 5G enable and drive the semiconductor market? You’ll hear from Jim on these topics and others!
|11:20 am – 11:50 am||Closing Keynote|
China Chips: Trade, Taiwan and Technology presented by Robert Maire, President, Semiconductor Advisors
The current trade issues involving the semiconductor industry between the US and China will be discussed, as well as the future of China in the semiconductor industry, and how China impacts other Asian competitors such as Taiwan. We will touch on mergers and acquisitions between China and the US and the impact of recent CFIUS decisions. The impact on technology and technology development will also be discussed.
|12:00 pm – 1:00 pm||Networking Lunch – Complimentary|
Agenda subject to change
Presented by Solid State Technology
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