The ConFab — an executive invitation-only conference now in its 14th year — brings together influential decision-makers from all parts of the semiconductor supply chain for three days of thought-provoking talks and panel discussions, networking events and select, pre-arranged breakout business meetings.
In the 2018 program, we will take a close look at the new applications driving the semiconductor industry, the technology that will be required at the device and process level to meet new demands, and the kind of strategic collaboration that will be required. It is this combination of business, technology and social interactions that make the conference so unique and so valuable.
Here are six key trends that will each have a huge impact in the near future:
To meet the demands of these diverse applications, much innovation will be required on the technology side along with huge efforts to reduce the overall cost. Since the beginning, the economics of semiconductor manufacturing has been a focal point of The ConFab. In 2018, we will be including insights into the emerging and rapidly growing new markets and what semiconductor device manufacturers need to know to successfully tap into those markets.
New technology needed in manufacturing will be another focal point of The ConFab. EUV is finally entering volume production, ushering in a new era of patterning for the 7 and 5nm generations. Many new materials are being considered, transistors are evolving from FinFETs to gate-all-around nanowires, on chip communication with silicon photonics will soon emerge, and advanced packaging/heterogeneous integration is ever more critical.
With greater demands throughout the industry, heightened interest and involvement, the 2018 program will explore how businesses, people and technology must all work together to meet the world’s insatiable demand for new electronics.
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