The Call for Papers for The ConFab 2015 is Now Open!
We are presently recruiting speakers and panelists interested in speaking on the following topics:
- Economic outlook of the semiconductor and related industries
- The economics of semiconductor manufacturing
- How mobile devices and the Internet of Things are driving semiconductor device requirements
- Technology trends in the semiconductor industry
- Tips on managing legacy fabs
- Collaboration between chip designers, foundries and OSATs
- New applications for semiconductors and related devices
Click here for more information on the call for papers
2014 CONFERENCE OVERVIEW
What’s on our Mind?
Presented by Dr. Roawen Chen, Senior Vice President Global Operations, Qualcomm
As mobile computing becomes the mainstay and the fast-growing segments of semiconductor industry over the last few years, the increased performance and rapid shift from traditional handsets to consumer computing device post a number of manufacturing and supply chain challenges for fabless chip makers. The scale of the challenges also creates an extreme stress for the existing foundry/fabless model to defend its excellence at this dynamic landscape. In this Keynote of “What’s on our Mind?” a number of headwinds and opportunities will be deliberated.
Keynote Address Tuesday, June 24, 2014 8:00 a.m. – 8:45 a.m.
Semiconductor Technology: Trends, Challenges, & Opportunities
Presented by Dr. Gary Patton, Vice President, IBM Semiconductor Research and Development Center
Semiconductor chip technology has had a profound impact on the world, entering almost all facets of modern life. The catalyst for this has been the exponential growth in computing power which has in turn been driven by economics: smaller features result in better performance and cost/function, which in turn leads to more applications and larger markets. Those economics and the challenges of technology scaling have both changed in a fundamental way over the past decade. To meet the significant economic challenges, the industry needs both technical and business innovation with new ecosystem and partnership models which leverage and balance the cost of scaling. Traditional CMOS scaling, which has driven device performance during the past several decades, is approaching atomistic and quantum-mechanical boundaries. In order to realize maximum cost benefit and future sustainable cost reduction, we need to employ new and somewhat orthogonal scaling approaches. The industry is in an exciting time of reinvention and is drawing on a rich pipeline of differentiated technology innovations such as: finfet devices, carbon nanotubes, 2.5 /3D packaging, and new design methodologies. Dr. Patton’s keynote will discuss these industry forces and describe the key elements of both technical and business innovation in the semiconductor R&D roadmap that are needed to solve the significant challenges of continued technology scaling (traditional and orthogonal). —————————————————————————–
Conference Sessions Monday, June 23, 2014 8:45 a.m. – 10:45 a.m.
Industry Outlook and Major Trends
The semiconductor market will continue at a steady growth rate for the next several years. For a semiconductor company to achieve significant growth in this ultra-competitive environment, it needs to identify market opportunities and predict the future, in terms of markets, both regionally and globally, anticipate technological advancements, as well as envision new applications. These presentations will provide an overview of the critical issues:
Techno-Economics of $0.35T Semiconductor Industry driving $85T GWP
Presented by Subramani Kengeri, VP, Advanced Technology Architecture, GLOBALFOUNDRIES
Semiconductors are only a fraction of Gross World Product, but a critical enabler of Global Economic Growth and Productivity. Cost effective technology innovations have kept Moore’s law alive, although techno-economic challenges are mounting on each successive node. The cost of building a new advanced fab has reached $6B. Process development and chip design costs are going up astronomically, while next generation SoCs in the IoT era are pushing cost-per-function to unprecedented levels. This talk will review advanced design and silicon technology challenges posing threats to cost effective scaling, potentially impacting Global GWP and Productivity.
The Economics of Semiconductor Manufacturing and the Escalating Cost of R&D
Presented by Vijay Ullal, COO, Fairchild Semiconductor
While innovation in semiconductor technology is driving change in industries from automotive to mobile, and the sophistication of computers, mobile devices, automobiles, industrial systems and consumer goods evolves, greater pressure is placed on semiconductor research and development (R&D) as well as Supply Chain Management (SCM). Now, the bar has been raised from not only delivering leading-edge technology, but also to delivering far greater value to an organization. We will use examples of how to focus R&D as well as revitalize your supply chain in order to highlight your competitive advantages, and better meet these market place demands by moving beyond the “product sell” to an approach that focuses instead on the key attributes customer’s value.
More-than-Moore: A New Era of Innovation
Presented by Dave Anderson, CEO, Novati Technologies
The semiconductor industry has focused on Moore’s Law for more than 40 years in its quest for ever shrinking geometries to squeeze more transistors on a chip and improve device speed and performance. Digital microcircuits have benefited immensely from this extreme scaling but with fewer companies having the ability to support further scaling, More-than-Moore (MtM) has emerged to apply decades of semiconductor process knowledge to novel applications to produce state-of-the-art biochips, sensors, actuators, imagers and more. Perhaps most importantly, MtM technology is enabling companies to build these components more cost-effectively and with better performance, and smaller size than ever before. Providing a significant advantage over traditional volume foundries, a new wave of boutique nanotechnology development centers is in a unique position to integrate new materials with custom processes. This provides a rapid acceleration of development and production for world-leading ideas and breakthrough MtM products. The result is a new era of innovation that couples the best of the past with future demands to create valuable applications and markets. See exactly how the era for enabling the most rapid, but affordable, new product development and deployment has begun.
450mm Transition Toward Sustainability: Facility & Infrastructure Requirements
Presented by Adrian Maynes, F450C Program Manager
It is widely accepted that in the next few years the semiconductor industry will begin to transition to the next generation 450mm wafer size. Experts throughout the industry are striving to make 450mm a reality from a technical and manufacturing standpoint. Along with the increase in wafer size, the industry is closely examining impacts to the facility infrastructure, as merely scaling the manufacturing process is not a practical option. The size of the 450mm facility infrastructure and its associated utility consumption projections would simply exceed affordability and resource availability. The facility experts involved in establishing and later implementing 450mm infrastructure requirements are facing the same degree of challenges as the IC and equipment manufacturers. For the first time in semiconductor history, facility professionals are collaborating closely with the industry’s top five consolidated IC manufacturers to bring their collective expertise to bear on the most pressing 450mm fab issues. With special focus on safety, cost, schedule, sustainability, and environmental footprint, this global consortium of industry specialists is aiming to reduce the cost of production, increase productivity for manufacturers, and reduce the environmental footprint on a per chip basis. We will address these various infrastructure requirements and potential issues for a more sustainable manufacturing process. The session will be co-presented by leaders of the Facilities 450mm Consortium (F450C) and the Global 450mm Consortium (G450C). These two groups are collaborating as experts from across the entire supply chain to ensure a smooth transition to the 450mm technology.
Major Trends Impacting the IC Industry of the Future
Presented by Bill McClean, President, IC Insights
IC Insights forecasts that 2014 will continue the integrated circuit industry cyclical upturn that began in 2013. This cyclical upturn is expected to gain momentum over the next several years, resulting in a 6.4% IC market CAGR over the 2013-2018 time period, which would be more than 3x the 1.7% CAGR the IC market displayed from 2007-2012. Although a high level of uncertainty still looms over the global economy, sales of smartphones and tablet PCs continue to soar. We will present our forecast for the IC market in the context of the IC industry cycle model. In order to make sense out of the current turmoil, a top-down analysis of the IC market will be given and include trends in worldwide GDP growth, electronic system sales, and semiconductor industry capital spending and capacity.
Conference Panel Session Monday, June 23, 2014 2:05 p.m. – 3:15 p.m.
Optimizing R&D Collaboration
We will focus on how the semiconductor industry can continue to innovate in an environment where lower revenue growth is combined with rising development costs and consolidation. The panel will discuss where the next big growth drivers will come from and the ability of the industry to continue scaling and remain on Moore’s Law through the introduction of new technologies such as EUV, Advanced Packaging and 450mm. We’ll talk about costs to develop these and how other technologies affect innovation, and what levers can be utilized to gain more efficiencies in R&D. The panel will also discuss what role startups will play in the industries going forward and how increased collaboration can benefit the industry.
Moderator: Scott Jones, Senior Consultant, AlixPartners
Chris Danely, Senior Analyst, JP Morgan
Lode Lauwers, Senior Director of Business Development, imec
Rory McInerny, Vice President Platform Engineering Group, Intel
Mike Noonen, Co-founder, Silicon Catalyst
Conference Panel Session Tuesday, June 24, 2014 8:45 a.m. – 10:15 a.m.
Supply Chain Management
Today’s leading companies are continually challenged by the need to deliver new products that meet customer requirements, while also increasing revenue growth and profitability and efficiently managing a global operation. Top supply chain priorities include meeting customer on-time delivery performance, reducing the time to commercialize new products and effective production capacity management. In this session, we’ll hear from a panel of experts from both inside and outside the semiconductor industry on how to best optimize your supply chain.
Moderators: Chris Pocek, Director and Chris Lanman, Vice President, AlixPartners
Dennis Arnow, Vice President Global Supply Chain, Atmel
Rubik Babakanian, CPO & Head of Supply Chain, Western Digital Dr. Paul Rawlings, Vice President Marketing, Edwards
Garrett Van Ryzin, Professor of Private Enterprise, Columbia University Graduate School
Conference Panel Session Tuesday, June 24, 2014 2:25 p.m. – 3:45 p.m.
Packaging: The Road to Higher Levels of Integration
Packaging technology is driven by a combination of cost, performance, form factor and reliability. Panelists will examine new advances in conventional back-end packaging, as well as the role of new 2.5D and 3D integration in the effort to reach higher levels of integration.
Moderator: Dr. William Chen, Fellow, ASE Group
Steve Bezuk, Dir. of Advanced Packaging Technology, Qualcomm
Bryan Black, Senior Fellow, AMD
Phil Garrou, Microelectronic Consultants
Ron Huemoeller, Senior VP, Advanced Tech/Platform Dev., Amkor
Conference Sessions Wednesday, June 25, 2014 9:20 a.m. – 11:00 a.m.
Emerging Applications and Technology Drivers The industry is increasingly driven by applications outside of the mainstream, such as automotive, medical, IoT, mobile computing, the smart grid, and wearable electronics. We will take a deep dive into these applications, look at how some start-ups are working to best position themselves to benefit from the explosive growth expected.
Presenter: Janos Veres, Program Manager, PARC – Palo Alto Research Center Wednesday,
June 25, 2014
1:00 p.m. ~ The ConFab 2014 concludes … thank you!