2014 Agenda

2014 AGENDA-AT-A-GLANCE

Sunday, June 22

5:45 – 8:00 PM Registration Sponsored by EV Group
6:00 – 8:00 PM Welcome Reception  Sponsored by KLA-Tencor

Monday, June 23

7:00 AM – 5:00 PM Registration  Sponsored by EV Group
7:00 – 7:55 AM Networking Breakfast  Sponsored by NY Loves Nanotech and Marcy Nanocenter
7:55 – 8:00 AM Opening Remarks  Pete Singer, Conference Chair
8:00 – 8:45 AM Keynote Address  Sponsored by Brewer Science, presented by Dr. Roawen Chen, Senior Vice President Global Operations, Qualcomm“What’s On Our Mind?”

As mobile computing becomes the mainstay and the fast-growing segments of semiconductor industry over the last few years, the increased performance and rapid shift from traditional handsets to consumer computing device post a number of manufacturing and supply chain challenges for fabless chip makers. The scale of the challenges also creates an extreme stress for the existing foundry/fabless model to defend its excellence at this dynamic landscape. In this Keynote of “What’s on our Mind?” a number of headwinds and opportunities will be deliberated.

8:45 – 10:45 AM Industry Outlook and Major Trends  Sponsored by Nanolab Technologies

The semiconductor market will continue at a steady growth rate for the next several years. For a semiconductor company to achieve significant growth in this ultra-competitive environment, it needs to identify market opportunities and predict the future, in terms of markets, both regionally and globally, anticipate technological advancements, as well as envision new applications. These presentations will provide an overview of these critical issues:

Techno-Economics of $0.35T Semiconductor Industry driving $85T GWP Subramani Kengeri, VP, Advanced Technology Architecture, GLOBALFOUNDRIES

Semiconductors are only a fraction of Gross World Product, but a critical enabler of Global Economic Growth and Productivity. Cost effective technology innovations have kept Moore’s law alive, although techno-economic challenges are mounting on each successive node. The cost of building a new advanced fab has reached $6B. Process development and chip design costs are going up astronomically, while next generation SoCs in the IoT era are pushing cost-per-function to unprecedented levels. This talk will review advanced design and silicon technology challenges posing threats to cost effective scaling, potentially impacting Global GWP and Productivity.

The Economics of Semiconductor Manufacturing and the Escalating Cost of R&D Chris Ball, WW VP Supply Chain Mgmt. and Customer Service, Fairchild Semiconductor

While innovation in semiconductor technology is driving change in industries from automotive to mobile, and the sophistication of computers, mobile devices, automobiles, industrial systems and consumer goods evolves, greater pressure is placed on semiconductor research and development (R&D) as well as Supply Chain Management (SCM). Now, the bar has been raised from not only delivering leading-edge technology, but also to delivering far greater value to an organization. We will use examples of how to focus R&D as well as revitalize your supply chain in order to highlight your competitive advantages, and better meet these market place demands by moving beyond the “product sell” to an approach that focuses instead on the key attributes customer’s value.

More-than-Moore: A New Era of Innovation Dave Anderson, CEO, Novati Technologies The semiconductor industry has focused on Moore’s Law for more than 40 years in its quest for ever shrinking geometries to squeeze more transistors on a chip and improve device speed and performance.  Digital microcircuits have benefited immensely from this extreme scaling but with fewer companies having the ability to support further scaling, More-than-Moore (MtM) has emerged to apply decades of semiconductor process knowledge to novel applications to produce state-of-the-art biochips, sensors, actuators, imagers and more. Perhaps most importantly, MtM technology is enabling companies to build these components more cost-effectively and with better performance, and smaller size than ever before. Providing a significant advantage over traditional volume foundries, a new wave of boutique nanotechnology development centers is in a unique position to integrate new materials with custom processes. This provides a rapid acceleration of development and production for world-leading ideas and breakthrough MtM products.  The result is a new era of innovation that couples the best of the past with future demands to create valuable applications and markets. See exactly how the era for enabling the most rapid, but affordable, new product development and deployment has begun. 450mm Transition Towards Sustainability: Facility & Infrastructure Requirements Mark Thirsk and Adrian Maynes, F450C Program Manager

It is widely accepted that in the next few years the semiconductor industry will begin to transition to the next generation 450mm wafer size. Experts throughout the industry are striving to make 450mm a reality from a technical and manufacturing standpoint. Along with the increase in wafer size, the industry is closely examining impacts to the facility infrastructure, as merely scaling the manufacturing process is not a practical option. The size of the 450mm facility infrastructure and its associated utility consumption projections would simply exceed affordability and resource availability. The facility experts involved in establishing and later implementing 450mm infrastructure requirements are facing the same degree of challenges as the IC and equipment manufacturers. For the first time in semiconductor history, facility professionals are collaborating closely with the industry’s top five consolidated IC manufacturers to bring their collective expertise to bear on the most pressing 450mm fab issues. With special focus on safety, cost, schedule, sustainability, and environmental footprint, this global consortium of industry specialists is aiming to reduce the cost of production, increase productivity for manufacturers, and reduce the environmental footprint on a per chip basis.  We will address these various infrastructure requirements and potential issues for a more sustainable manufacturing process. The session will be co-presented by leaders of the Facilities 450mm Consortium (F450C) and the Global 450mm Consortium (G450C). These two groups are collaborating as experts from across the entire supply chain to ensure a smooth transition to the 450mm technology.

Major Trends Impacting the IC Industry of the Future Bill McClean, President, IC Insights IC Insights forecasts that 2014 will continue the integrated circuit industry cyclical upturn that began in 2013.  This cyclical upturn is expected to gain momentum over the next several years, resulting in a 6.4% IC market CAGR over the 2013-2018 time period, which would be more than 3x the 1.7% CAGR the IC market displayed from 2007-2012. Although a high level of uncertainty still looms over the global economy, sales of smartphones and tablet PCs continue to soar.  We will present our forecast for the IC market in the context of the IC industry cycle model.  In order to make sense out of the current turmoil, a top-down analysis of the IC market will be given and include trends in worldwide GDP growth, electronic system sales, and semiconductor industry capital spending and capacity.
10:45 – 11:00 AM Networking Break  Sponsored by Qcept Technologies
11:15 – 12:00 PM Private Boardroom Meetings
12:00 – 1:00 PM Networking Lunch   Sponsored by Lam Research
1:10 – 1:55 PM Private Boardroom Meetings
2:05 – 3:15 PM Panel Session: Optimizing R&D Collaboration  Sponsored by ULVAC Technologies, Inc.

We will focus on how the semiconductor industry can continue to innovate in an environment where lower revenue growth is combined with rising development costs and consolidation.  The panel will discuss where the next big growth drivers will come from and the ability of the industry to continue scaling and remain on Moore’s Law through the introduction of new technologies such as EUV, Advanced Packaging and 450mm.  We’ll talk about costs to develop these and how other technologies affect innovation, and what levers can be utilized to gain more efficiencies in R&D.  The panel will also discuss what role startups will play in the industries going forward and how increased collaboration can benefit the industry.

Moderator:  Scott Jones, Director, Alix Partners Panelists: Rory McInerny, Vice President Platform Engineering Group, Intel Chris Danely, Senior Analyst, JP Morgan Mike Noonen, Co-founder, Silicon Catalyst Lode Lauwers, Senior Director of Business Development, imec
3:15 – 3:30 PM Networking Break   Sponsored by Qcept Technologies
3:40 – 5:15 PM Private Boardroom Meetings
6:30 – 8:00 PM Networking Reception   Sponsored by Applied Materials

Tuesday, June 24

7:00 AM – 5:00 PM Registration Sponsored by EV Group
7:00 – 7:55 AM Networking Breakfast
8:00 – 8:45 AM Keynote Address   Sponsored by Siemens “Semiconductor Technology: Trends, Challenges, and Opportunities” Dr. Gary Patton, Vice President, IBM Semiconductor Research & Development CenterSemiconductor chip technology has had a profound impact on the world, entering almost all facets of modern life. The catalyst for this has been the exponential growth in computing power which has in turn been driven by economics:  smaller features result in better performance and cost/function, which in turn leads to more applications and larger markets. Those economics and the challenges of technology scaling have both changed in a fundamental way over the past decade. To meet the significant economic challenges, the industry needs both technical and business innovation with new ecosystem and partnership models which leverage and balance the cost of scaling. Traditional CMOS scaling, which has driven device performance during the past several decades, is approaching atomistic and quantum-mechanical boundaries. In order to realize maximum cost benefit and future sustainable cost reduction, we need to employ new and somewhat orthogonal scaling approaches.  The industry is in an exciting time of reinvention and is drawing on a rich pipeline of differentiated technology innovations such as: finfet devices, carbon nanotubes, 2.5 /3D packaging, and new design methodologies.  Dr. Patton’s keynote will discuss these industry forces and describe the key elements of both technical and business innovation in the semiconductor R&D roadmap that are needed to solve the significant challenges of continued technology scaling (traditional and orthogonal).
8:45 – 10:15 AM Supply Chain Management PanelToday’s leading companies are continually challenged by the need to deliver new products that meet customer requirements, support an ever-increasing revenue growth and profitability goals, and efficiently manage global operations. Top supply chain priorities include meeting customer on-time delivery performance, reducing the time to commercialize new products, and improving the effectiveness of production capacity management.  Moreover, it’s fundamental to have predictive analytics in place to meet the aforementioned supply chain priorities and to best understand all potential risks.  In this session, you’ll hear from a panel of supply chain experts from both inside and outside the semiconductor industry on the challenges and opportunities of managing risks and how they tackle the conversion of massive amounts of data into consumable information to help improve a company’s value chain and performance. Moderators: Chris Pocek, Director and Chris Lanman, Vice President, AlixPartners Panelists: Rubik Babakanian, CPO & Head of Supply Chain, Western Digital Dennis Arnow, Vice President Global Supply Chain, Atmel Dr. Paul Rawlings, Vice President Marketing, Edwards Garrett Van Ryzin, Professor, Columbia University Graduate School
10:15 – 10:30 AM Networking Break  Sponsored by Applied Materials
10:40 – 12:15 PM Private Boardroom Meetings
12:15 – 1:25 PM Networking Lunch   Sponsored by KLA-Tencor
1:30 – 2:15 PM Private Boardroom Meetings
2:25 – 3:45 PM Panel Session: Packaging: The Road to Higher Levels of Integration Technical Sponsor: IEEE CPMT

Packaging technology is driven by a combination of cost, performance, form factor and reliability. Panelists will examine new advances in conventional back-end packaging, as well as the role of new 2.5D and 3D integration in the effort to reach higher levels of integration.

Moderator: Bill Chen, ASE Speakers: Phil Garrou, IEEE Fellow Bryan Black, Senior Fellow, AMD Ron Huemoeller, Senior Vice President, Advanced Technology/Platform Development, Amkor Steve Bezuk, Director of Advanced Packaging Technology, Qualcomm Die Stacking Is Happening Bryan Black, Senior Fellow, AMD

Die stacking has proven effective in MEMs and FPGA solutions but has yet to impact mainstream computing CPUs and GPUs. The talk will explain why, after more than 10 years of development, die stacking is finally happening in mainstream computing. The talk will close with an outline of how die stacking is going to impact the industry over the next 10 years

3:45 – 4:00 PM Networking Break   Sponsored by Applied Materials
4:10 – 5:45 PM Private Boardroom Meetings
6:30 – 8:00 PM Networking Reception  Sponsored by Brewer Science

Wednesday, June 25

7:30 – 8:30 AM Networking Breakfast
8:30 – 9:15 AM Private Boardroom Meetings
9:20 – 11:00 AM Emerging Applications and Technology Drivers  Sponsored by Applied Seals North America, Inc.The industry is increasingly driven by applications outside of the mainstream, such as automotive, medical, IoT, mobile computing, the smart grid, and wearable electronics. We will take a deep dive into these applications, look at how some start-ups are working to best position themselves to benefit from the explosive growth expected. Printing Objects and Additive Manufacturing

Janos Veres, Program Manager, PARC – Palo Alto Research Center

Printed electronics are at a pivotal moment. There are not only tremendous opportunities for innovation and growth in new verticals and industries, but a new way of thinking about how electronics are made, combining techniques and materials used by printed electronics with those of 3D printing. Printing many of the components of a phone – including sensors, mechanical components, and electronics – using a single printer is now imaginable. Printed electronics is rapidly becoming a manufacturing tool that can print complex objects with embedded intelligence. We’re developing new materials that allow us to print inks that work as electronics, structural materials, or both. Moreover, our materials and processes also work all printing technologies used in the last 200 years, thus allowing us to retrofit existing printing and manufacturing processes with modern capabilities. Janos will review printed electronics and discuss future directions, from smart labels and wearables, to trends and technologies that enable the printing of devices with embedded sensors, transistors, displays, batteries and memory.

Trends in LED Manufacturing

Iain Black, VP WW Mfg. Engineering, Technology & Innovation, Philips Lumileds

The LED manufacturing process is somewhat similar to mainstream semiconductor manufacturing, in that it involves a substrate (either sapphire or GaN), deposition of a fairly complex epitaxial structure (by metal organic chemical vapor deposition, MOCVD), followed by wafer processing (contact formation, etch, thinning), die separation and packaging. Iain will address how the Industry is developing, the up integration of LED solutions including a discussion of customers and the kind of problems commonly addressed.

Inside Today’s Systems & Chips: A Survey of the Past Year

Dick James, Senior Technology Analyst at Chipworks

Last year we reviewed some of the trends in the semiconductor industry that we can derive from teardowns. Some of these are self-evident to any industry watcher: 4G/LTE phones are becoming the standard, demanding complex multi-band RF capability; Flash memory capacity seems to have leveled out – no 128 GB phones!; Cameras are trending up to 13 Mp/16Mp; Ever faster processors – now we see the first 64-bit processor in the iPhone 5s, with yet more graphics capability; Consequently more dynamic memory to cope with the data being processed. In this talk, we’ll look at some of the leading edge products from the last year or two to see what extra information we can divine from looking inside the technology. In addition to looking at the bill of materials, more detailed information about design win trends, technology advances, and manufacturing processes can be deduced.

Enabling the Supply Chain Accelerate R&D and Stay in Sync with the IC Scaling Cadence and Consumer Demand

Gopal Rao, Consultant

Accelerating the right product to market is key to success and securing a foothold in a fast moving consumer driven, profitable market. There is a push/pull market energy that is now, more than ever, influencing the device makers, suppliers and the consumers who are thirsty for innovative mobile computing and connected devices. The IC industry has relied on a push based roadmaps to bring products to market. It is important that we acknowledge that the consumer appetite for innovative and cool products has created a pull system that may be considered a roadmap. The challenge facing the whole IC industry is how to recognize, rationalize and leverage these push/pull roadmaps. This talk examines this IC industry challenge and opportunity, specifically in moving the vast supply chain to feed into this fast moving market. The pace of R&D through entire supply chain is essential in staying ahead of the curve and driving down cost of technology and manufacturing. Radical, innovative product designs to meet consumer demand will push into the IC supply chain the need to identify and develop significant cost/performance improvements in IC device performance. What are these improvements? Are the current roadmaps highlighting them or do we need a better, integrated intelligent roadmap that helps the supply chain stay on treadmill of innovation and cost reduction?

11:00 – 11:15 AM Networking Break  Sponsored by Chipworks
11:20 – 11:55 AM Private Boardroom Meetings
12:00 – 1:00 PM Networking Lunch The ConFab 2014 concludes, Thank You

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